Apply Now for Erasmus+ KA171 (ICM) Staff Mobility for Academic Staff at Haliç University, Türkiye!)

 

Apply Now for Erasmus+ KA171 (ICM) Staff Mobility for Academic Staff at Haliç University, Türkiye 🇹🇷!

 

Respected Sir/Madam,

Greetings from International Affairs, DIU!

 

Daffodil International University (DIU) has an active partnership with Haliç University, Türkiye 🇹🇷, through the Erasmus+ KA171 International Credit Mobility (ICM) Project. Under this partnership, DIU will nominate one (1) academic staff member to participate in the Erasmus+ KA171 Staff Mobility Program, which will take place in 2026, at the stunning campus of Haliç University, Türkiye.

In this regard, we invite eligible academic staff members to apply for this exceptional opportunity.

 

Eligible Department: 

  • Computer Science and Engineering
  • Software Engineering
  • Multimedia & Creative Technology 
  • Computing and Information System
  • Information Technology & Management 
  • Information and Communication Engineering
  • Textile Engineering
  • Electrical and Electronic Engineering

 

Furthermore, DIU academic staff may present lectures/sessions and join meetings at Haliç University, Türkiye, subject to prior planning and availability.

Erasmus+ Grants for Participants*: Minimum Available Grant  €1700

*The grant will primarily cover visa fees, international airfare, and local hospitality costs to participate in the Erasmus+ International Credit Mobility Program. Any additional expenses beyond the allocated fund must be borne by the individual candidate, not by the home or host university.

Erasmus Grade & Selection Criteria: Click Here

 

We look forward to receiving applications from DIU academic staff. Upon submission, both DIU and Haliç University, Türkiye, will review applications and select the final candidate for participation.

 

Nomination Deadline: 14 November, 2025

Application Link: https://forms.gle/gUjzVEqHXvXgHGuaA

 

For any queries, please contact: erasmus@daffodilvarsity.edu.bd

 

We appreciate your cooperation in strengthening DIU’s internationalization efforts.

 

Thank you!


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